X-ray diffraction-based scanning system

ABSTRACT

An x-ray diffraction-based scanning method and system are described. The method includes screening for a particular substance in a container at a transportation center using a flat panel detector having a photoconductor x-ray conversion layer to detect x-rays diffracted by a particular substance in the container. The diffracted x-rays may be characterized in different ways, for examples, by wavelength dispersive diffraction and energy dispersive diffraction.

TECHNICAL FIELD

This invention pertains to the field of x-ray scanning systems and, inparticular, to x-ray diffraction-based scanning systems.

BACKGROUND

The events of Sep. 11^(th) 2001 forced recognition of an urgent need formore effective and stringent screening of airport baggage. The need forsecurity expanded from the inspection of carry-on bags for knives andguns to the complete inspection of checked bags for a range of hazardswith particular emphasis upon concealed explosives. The demonstratedwillingness of terrorists to die in the pursuit of their aims meant that100% passenger-to-bag matching, which could be put in place rapidly, wasnot sufficient to counter an attempt to conceal explosives in checkedbaggage and bring down an airliner. Successful screening for thepresence of explosives presents numerous technological challenges, manyof which are not met in present systems. X-ray imaging is the mostwidespread technology currently employed for screening. Last yearapproximately 1100 x-ray explosives detection systems incorporatingcomputerized tomography (CT) scanners were purchased by theTransportation Security Agency (TSA) in an accelerated procurementprogram directed toward a goal of 100% screening of checked bags by Dec.31^(st) 2002.

Existing x-ray baggage scanners, including CT systems, designed for thedetection of explosive and illegal substances are unable to discriminatebetween harmless materials in certain ranges of density and threatmaterials like plastic explosive. Thus, depending upon the level of thesensitivity setting, they either pass through a percentage of threatmaterial, “missed detection” in security parlance, or they generate ahigh rate of false positives. CT scanner-based explosives detectionsystems are able to overcome problems of superimposition effects thatarise in line scan systems. CT measures average x-ray absorption pervoxel in slices projected through suspect regions of a bag. Thisparameter is not sufficiently specific to distinguish explosives frommany other common materials. Items implicated in false positives includecandy, various foodstuffs (e.g., cheese), plastics, and toys. Muchattention has attended the deployment of CT-based explosives detectionsystems and their high false positive rate of around 30% in real worldoperating conditions is now well publicized in the media and has beenacknowledged by the TSA. Concerns have been expressed about theresultant need to open and hand search a substantial portion of thechecked bags, out of sight of the owner of the luggage. This is timeconsuming and expensive for the airlines and the prospect of airportdelays and the potential for theft is a source of concern to thetraveling public.

Moreover, CT scanners are unable to detect the presence of explosivematerial that is formed into thin sheets because CT averages the x-rayabsorption coefficient over each voxel. Pentaerythritoltetranitrate(PETN), for example, will readily detonate when in the form of a sheet 1mm thick. The density of PETN is 1.77 g/cc and a sheet 50 cm×50 cm×1 mm,easily incorporated into the skin of a suitcase, weighs approximately442 grams, or almost 1 pound, which is sufficient to cause a powerfulexplosion.

Identification systems based on X-ray diffraction techniques provideenormously improved discrimination of materials. Such systems measurethe d-spacings between the lattice planes of micro-crystals inmaterials. This form of energy-selective diffraction imaging has beenemployed in a type of medical tomography and in the non-destructiveexamination of pigments in works of art. X-ray diffraction provides asubstance-specific fingerprint that greatly increases the probability ofspecific material detection and concomitantly reduces the incidence offalse positives. Its applicability to explosives detection and thedetection of other illicit substances has been demonstrated by YxlonInternational of Germany with a prototype diffraction-based system.

Prior x-ray diffraction-based security systems for explosives detectionand baggage scanning are not yet highly developed. These systems, suchas Yxlon's system as illustrated in FIG. 1, are based upon work done byBomsdorf and Muller at the University of Wuppertal in Germany. The Yxlonsystem utilizes small-area, single-crystal germanium (Ge) detectors. Adivergent tight cluster of collimated x-ray pencil beams, originatingfrom an effective point source, is directed through the bag underexamination and sensed by the high-purity Ge detector cooled to liquidnitrogen temperature of −196 degrees C. However, such a system suffersfrom a number of fundamental constraints. First, the high-purity Gedetector is too expensive to use in large area sensors. Second, therequirement for liquid nitrogen cooling is cumbersome and expensive tomaintain in an airport environment. In addition, they can examine only asmall area of a bag at one time due to the small detector size. Thisrequires multiple passes of the beam through the bag being screened inwhich the beam is meander-scanned (zig-zag, back-and-forth pattern)through the bag in order to inspect the entire contents of the bag. Thisis too slow for volume applications like routine baggage scanning. Testsdone by the Canadian Customs on detecting concealed samples of heroinand cocaine, which for a diffraction system is an equivalent task toidentifying an explosive compound, have indicated scan times of theorder of 1.5 minutes, far longer than the desired 6 seconds per bag.

SUMMARY OF THE INVENTION

An x-ray diffraction-based scanning method and system are described. Inone embodiment, the method includes providing a flat panel detectorhaving a photoconducting x-ray conversion layer and screening for aparticular substance in a container at a transportation center using theflat panel detector.

Other features and advantages of the present invention will be apparentfrom the accompanying drawings, and from the detailed description, whichfollows below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and not intendedto be limited by the figures of the accompanying drawings in which likereferences indicate similar elements and in which:

FIG. 1 illustrates a prior art x-ray diffraction scanning system.

FIG. 2A is a cross-section view illustrating one embodiment of an x-raydiffraction system.

FIG. 2B is a perspective view, respectively, illustrating one embodimentof an x-ray diffraction system.

FIG. 2C illustrates one embodiment of a pair of collimators havingorthogonal collimation planes with respect to each other.

FIG. 3 shows a plot of diffraction angle against x-ray photon energy forthe six strongest diffraction lines of trinitrotoluene (TNT).

FIG. 4A illustrates one embodiment of an x-ray diffraction system havinga movable detector assembly.

FIG. 4B is a top view along the primary axis of the x-ray sheet beam ofa diffraction system illustrating one embodiment of a detector assembly.

FIG. 5A illustrates one embodiment of components of a flat paneldetector.

FIG. 5B illustrates one embodiment of a flat panel detector having adirect conversion layer.

FIG. 5C illustrates an alternative embodiment of a flat panel detectorhaving a direct conversion layer.

FIG. 6 is an exemplary figure showing the x-ray sensitivity of apolycrytalline HgI₂ detector layer operating at room temperature with 80KV(p) photons.

FIG. 7 illustrates one embodiment of electronic components of thescanning

FIG. 8 illustrates one embodiment of an x-ray generator.

FIG. 9 illustrates an alternative embodiment of a flat panel detectorthat may be used with an energy dispersive mode of scan operation.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forthsuch as examples of specific components, processes, etc. in order toprovide a thorough understanding of the present invention. It will beapparent, however, to one skilled in the art that these specific detailsneed not be employed to practice the present invention. In otherinstances, well known components or methods have not been described indetail in order to avoid unnecessarily obscuring the present invention.

The terms “above,” “below,” and “between” as used herein refer to arelative position of one layer or component with respect to another. Assuch, one layer deposited or disposed above or below another layer, orbetween layers, may be directly in contact with the other layer(s) ormay have one or more intervening layers. Moreover, one component infront, behind, below or between another component may be in physicalcontact with the other component or may have one or more interveningcomponents, or may be otherwise indirectly coupled with other component.The term “coupled” as used herein means connected directly to orconnected indirectly through one or more intervening components oroperatively coupled through non-physical connection (e.g., optically).

A diffraction-based x-ray system is described. The diffraction-basedx-ray system may be used to detect and measure atomic layer spacing incrystalline and microcrystalline materials to provide a means ofspecific material identification. Classical x-ray diffraction takesplace from the atomic layer planes in crystals. In accordance with theBragg equation, constructive interference takes place when:Nλ=2d sin θwhere, λ is the x-ray photon wavelength, d is the atomic layer planespacing, and θ is the diffraction angle. The d-spacings of the atomiclayer planes are substance-specific and diffraction data provides anon-contact x-ray fingerprint for identifying crystalline materials.

In one particular embodiment, the x-ray system may be used fortransportation center (e.g., an airport, train station, etc.) container(e.g., bags, luggage, boxes, etc.) scanning for the detection of aparticular substance, for example, an explosive. The majority ofexplosive compounds are well-crystallized solids at room temperature.Even “plastic explosive” is composed of a high explosive such as PETN orRDX in powder form, which is highly crystalline on a micro-scale,dispersed in a soft binder of polyurethane and wax.

The sensitivity of the diffraction technique is enhanced by the natureof the typical baggage contents, e.g., predominantly garments, paper andplastics, which are amorphous materials which do not interact with theincident x-ray beam to give strong coherent diffraction signals. Metalsare crystalline (in particular, microcrystalline) and efficientlydiffract x-rays, but the atomic layer d-spacings in the compact crystallattices of metals are small, e.g., in the range 0.5–2.5 Angstroms (Å),compared to those of larger crystalline organic compounds which aretypically in the range 2–10 Å. Therefore, x-ray diffraction lines thatoriginate from metal materials are distinguishable from those from mostother materials, including explosives.

The x-ray diffraction system may use conventional wavelength-dispersive(WD) diffraction or fixed-angle, multi-wavelength diffraction forimproved throughput. In addition, the use of a large-area flat-panelx-ray detector having a two dimensional array of pixels, or multiplesmaller area flat-panel detectors, coupled with an elongated x-raysource may permit a full three-dimensional (3D) volumetric x-raydiffraction scan of a container in a single pass and, thereby, improvethe throughput of the screening system. Further, orthogonal collimatorsmay placed in front of the flat panel detector to limit the acceptanceangle of x-ray photons entering the flat panel detector and also ensurethat each small block of pixels of the flat panel detector(s) views aseparate area of the sheet beam, thereby dividing it into volumeelements.

Although the diffraction-based x-ray system may be described at times inrelation to the detection of explosives for baggage screening for easeof discussion, the system is not so limited. In alternative embodiments,the diffraction-based x-ray system described herein may be used todetect other substances and for other purposes.

FIGS. 2A and 2B are a cross-section view and a perspective view,respectively, illustrating one embodiment of an x-ray diffractionsystem. The x-ray diffraction system 200 includes an x-ray generator 210having an x-ray source, a pair of collimators 275, and a two dimensional(2D) flat panel detector (FPD) array 276. The x-ray generator 210 iscomposed of an x-ray tube with a longitudinally extended target and oneor more x-ray beams to generate an x-ray sheet beam 220, as furtherillustrated in FIG. 8. In one embodiment, the x-ray sheet beam 220 iscomposed of a continuous highly collimated x-ray sheet. In analternative embodiment, the x-ray sheet beam 220 is composed of multipleclose parallel-collimated sub-beams generated by source collimator 215.

As illustrated by FIG. 8, source collimator 215 may include collimatorblocks 217 that operate to limit beam divergence in the x-direction andcollimator foils 218 that operate to limit beam divergence in they-direction. A linear electron gun 213 may be used to generate anelectron beam 219 using cathode 212. The electron beam 219 strikes thesurface 209 of an elongated (e.g., in the range of 1 mm to 2 meters)rotating x-ray target (anode) 211 to generate x-rays that emanatethrough window 216. In one particular embodiment, target 211 has a widthof approximately 1 meter. As discussed above, collimator 215 may be usedto collimate the x-rays to produce x-ray sheet beam 220. The shape ofthe beam may be configured by altering the shape of x-ray target 211. Inone embodiment, for example, cuts may be made in surface 209 to producea “picket-fence-like” x-ray sheet beam 220 composed of multiple,individual beams. It should be noted that alternative configurations forthe x-ray generator 210 may be used to produce x-ray sheet beam 220.

In one embodiment, the x-ray generator 210 has a large target 211surface 209 area and can, therefore, operate at high peak and averagepower. If provided with adequate heat removal capacity, for exampleliquid cooling of the target 211 via a ferrofluidic seal, it can operatecontinuously with ≧100 KW of input power. The rate at which adiffraction system can acquire data depends upon the detectorefficiency. However, once the detector efficiency has been optimized thedata acquisition rate scales directly with the available input x-raypower.

The limit on the throughput of the above diffraction system in atransportation center operating environment is likely to be set byavailable wall plug power. If this is, for example 50 KW, and the dutycycle for tube operation is less than 100% then an energy storage system(for example a compact flywheel unit) drawing a continuous 50 KVA can beuse to increase the available power input to the tube during its ontime. If the tube operates with a 50% duty cycle it could be operatedwith 100 KW of input power.

Referring again to FIGS. 2A and 2B, the x-ray sheet beam 220 is directedto a container 240 on a conveyor 250 as the conveyor moves the container240 in direction 243 through the axis of the x-ray sheet beam 220. Thex-ray sheet beam 220 passes vertically through the container 240 to bescanned as it moves along conveyer 250 in direction 243. Alternatively,the container 240 to be scanned need not be on a conveyor 250, but maybe positioned under the x-ray sheet beam 220 through other means. In oneembodiment, the width of the x-ray beam 220 is selected to cover, forexample the whole width (e.g., 242) of container 240. Alternatively, thex-ray beam 220 may have a width 249 greater than the width of conveyor250 (as illustrated in FIG. 2B). The x-ray sheet beam 220 may havewidths, for example, in the approximate range of 2 mm to 2 meters asdetermined by the width of the x-ray target 211.

If the x-ray sheet beam 220 intercepts a crystalline material in thecontainer 240 (e.g., a plastic explosive), x-ray photons are diffractedat an angle (θ) 264 to the incident x-ray beam. The angle 264 dependsupon the d-spacing of the atomic planes in the material. Thetrajectories of the diffracted photons lie on cones (e.g., cone 260)with half angle θ centered on the beam axis. The diffracted x-rays 265are detected and their properties measured by a detector assembly 270located below the conveyer 250 and displaced laterally from the path ofthe primary sheet beam so that the detector assembly 270 collects thediffracted x-rays 265. A linear detector 290 may be positionedunderneath the conveyor at the primary axis of the x-ray sheet beam 220to detected undiffracted components of the x-ray sheet beam 220. Thelinear detector (e.g., composed of a line of photoconducting diodes)measures the undiffracted x-ray beam and provides a reference signal andprojection line scan image of container 240.

In one embodiment, the detector assembly 270 may include first andsecond collimators 272 and 274 and a flat panel detector 276. The flatpanel detector 276 may have a conventional TFT structure with ascintillator or photoconductor x-ray direct conversion layer, asdiscussed below in relation to FIGS. 5A and 5B. In one embodiment, theconversion layer is amorphous and, in particular, may have apolycrystalline structure. Alternatively, the conversion layer may haveother crystalline structures. The detector assembly 270 may beconfigured to have a narrow acceptance angle of approximately 0.2degrees full width at half maximum (FWHM) by using one or morecollimators placed in front of the flat panel detector 276. Thecollimation planes of the first collimators 272 plates (e.g., plate 283)and the second collimator 274 plates (e.g., plate 293) may besubstantially orthogonal to each other, as illustrated in FIG. 2C. Thecollimators 275 ensure that each pixel 279 of the flat panel detector276 views a separate area of the beam, thus dividing the diffractedx-rays 265 into volume elements. In particular, first collimator 272divides the x-ray sheet beam into individual vertical (e.g., beamdirection 241 mapping to flat panel detector length 271) segments andsecond collimator 274 provides the angular resolution for acceptingdiffracted x-rays of a particular angle. Photons having a particulardiffraction angle are selected by the angle of the collimators 275 andflat panel detector 276 with respect to the primary x-ray sheet beam220. By tilting the second collimator 274 and flat panel detector 276together, it is possible to scan through the diffraction spectrum interms of diffraction angle. The first collimator 272 need not residewithin the detector assembly 270, such that only the second collimator274 and the flat panel detector 276 are movable. In an alternativeembodiment, the plates of the first and second collimators may beintegrated together to form a single collimator having orthogonalplates. Alternatively, other collimator arrangements known in the artmay be used, for examples, hexagonal collimators.

In FIGS. 2A and 2B, only a single detector assembly 270 having a largearea flat panel detector 276 is shown for clarity. Diffraction issymmetrical about the primary beam and multiple detector assembliesusing smaller area flat panel detectors can be located on the radialperiphery of cone 260 such as, for example, on diametrically opposedsides of the primary sheet beam (as discussed below in relation to FIG.4B), for improved sensitivity and signal to noise. In one embodiment, apair of Soller collimators may be used. Soller collimators are compactcollimators obtainable with a FWHM acceptance angle of 0.16° withgreater than 70% transmission and are commercially available from JJX-Ray of Denmark.

By collecting the diffracted x-rays from each volume element (voxel), itis possible to detect, identify and physically locate substances (e.g.,explosives) within container 240 as it is moved through the x-ray sheetbeam 220. The method is substance-specific and sensitive, with sub-voxeldetection capability because the substance does not need to fill anentire voxel to be identified. The requirement is merely that sufficientmaterial of the substance is intersected by the x-ray sheet beam 220 togive a diffracted photon signal that is above the detector noise level.

The diffracted x-rays may be characterized in different ways, forexamples, by wavelength dispersive (WD) diffraction and energydispersive (ED) diffraction. In wavelength dispersive diffraction, anincident x-ray beam may be composed of monochromatized x-rays containinga narrow range of wavelengths typically 1% or less, centered upon anx-ray emission line characteristic of the x-ray target material, forexample, a K-alpha line, to increase the photon flux in themonochromatized beam. The incident beam may be monochromatized, forexamples, by diffraction off a crystal, by absorption edge filtering,via a graded multilayer mirror, or by other means known in the art. Thelatter has the advantage of improved x-ray collection efficiency.

In one embodiment, a copper (Cu) target generating filtered Cu K-alpharadiation is used for the x-ray source. The radiation's 1.54 Åwavelength results in large diffraction angles that can be measured withhigh precision. However, Cu K-alpha radiation is rapidly attenuated evenby atmospheric air and more energetic x-ray photons may be necessary forcontainer scanning where the radiation must penetrate the full thicknessof a container which may contain strongly absorbing objects.

As such, in alternative embodiments, other types of targets 211generating other types of radiation may be used for the x-ray source. Inone embodiment, radiation having energy in the approximate range of 30to 120 KeV is used. Even higher energies may be used for still greaterpenetrating power but at the cost of decreased diffraction angles. Inone particular embodiment, for example, a tungsten (W) target 211generating W K-alpha characteristic radiation, with a photon energy of59.3 KeV and wavelength of 0.21 Å, may be more suitable for checked bagscanning. There is the added advantage that a tungsten target can beoperated with high beam voltage and at high beam power. The x-ray outputrises with both beam voltage and the atomic number of the targetmaterial. Thus a tungsten target is a more efficient producer of x-raysthan a copper target. The tradeoff is reduced diffraction angles due tothe shorter x-ray wavelength.

FIG. 3 shows a plot of diffraction angle against x-ray photon energy forthe six strongest diffraction lines of trinitrotoluene (TNT), which hasd-spacings typical of organic explosive compounds that might beencountered in a terrorist device. The range of angles at the 59.3 keVenergy of W k-alpha is of the order of 2.5°. With W K-alpha radiation inWD mode and measurement of crystal d-spacings down to 1.5 Å, the minimumvalue required for explosives screening, θ reaches a maximum of justover 4°. This parameter, together with the vertical height of thecontainer 240 to be scanned, may be used, in one embodiment, todetermine the required detector size in the direction 243 parallel tothe conveyer motion.

In x-ray crystallography, highly accurate measurement of diffractionangles is necessary for structure determination. The requirements areless stringent for matching a diffraction spectrum to a database ofspectra of threat compounds. The angular discrimination provided by asimple collimator system placed in front of the detector is sufficientto resolve “fingerprint” spectra adequate for matching purposes. Forexample, if the W k-alpha diffraction spectrum of TNT is convolved withthe 0.16° FWHM of a commercial Soller collimator, the diffraction linesshow significant broadening but the line definition is still adequatefor identifying proscribed material by comparison with referencespectra.

FIG. 4A illustrates one embodiment of x-ray diffraction system 200having a movable detector assembly 470 that may be used for operationwith wavelength dispersive diffraction. As previously discussed, in theWD mode the x-ray source of generator 210 is filtered so that the x-raysheet beam 220 contains only a narrow range of x-ray photon wavelengthsthat are centered upon, for example, the W K-alpha line. In WD mode, thex-ray diffraction lines 265 (only two exemplary diffraction lines areillustrated) are scanned by moving (e.g., by tilting, pivoting,rotating, sliding, etc.) 471 the detector assembly 470 from an angle θ₁to an angle θ₂ on the order of a few degrees. For example, for W K-alpharadiation, the angular extent of the scan may be of the order of 2.5degrees to cover the range of d-spacings that is of interest for thedetection and identification of explosives. With W K-alpha radiation inthe WD mode and measurement of crystal d-spacings down to 1.5 Å, themaximum value of θ may be approximately 4 degrees. Alternatively,another angular range θ₂–θ₁ may be used based on the particularsubstance to be detected. The conveyor 250 stops the container 240 ateach scan location and container 240 is scanned serially through theangles θ₁ to θ₂ that the x-ray sheet beam 220 is diffracted through. Thevertical position in the incident x-ray sheet beam direction 241 mapsonto the flat panel detector 276. This mapping changes with the angle θat which the detector assembly 470 is positioned with respect to theprimary axis of the x-ray sheet beam 220. A software routine may be usedto perform such a mapping.

Referring again to FIG. 2B, the vertical dimension 441 of the scannedarea is compressed by a factor of sine θ in the diffracted image on thesurface of flat panel detector 270 (and 470 of FIG. 4A). Thus, forexample, a 100 cm wide 242×75 cm high 241 scanned area in container 240maps onto a 100 cm wide 272×5.25 cm long 271 flat panel detector area.In practice, the flat panel detector 276 need not be in the form of asingle elongated panel (e.g., 100 cm×5.25 cm). Since x-rays arediffracted symmetrically outwards, the flat panel detector 276 can bedivided into several smaller panels, as illustrated in FIG. 4B.

FIG. 4B is a top view along the primary axis of the x-ray sheet beam ofsystem 200 illustrating one embodiment of a detector assembly.Continuing the above example, the flat panel detector 475 may be dividedinto four panels 476-479, each panel with active area of 25 cm×5.25 cm,located alternately on either side of the x-ray sheet beam primary axis221. In yet another embodiment, the panels residing on a side of primaryaxis 221 may be disposed within a separate assembly (e.g., panels 476,478 in one assembly and panels 477 and 479 in another assembly) or eachpanel may be disposed within its own assembly.

FIG. 5A illustrates one embodiment of components of a flat paneldetector. The flat panel detector 276 may be constructed as a panel witha matrix of photosensitive devices with readout electronics to transferthe light intensity of a pixel to a digital video signal for furtherprocessing or viewing. Flat panel detector 276 includes a conversionlayer formed by a scintillator layer 521 and a photodetector layer 526.Flat panel detector 276 also includes a substrate 527, a supply voltage523, capacitor 528, and switch 532. In one embodiment, for example,photodetector layer 526 may include photoconductors or photovoltaiccomponents (e.g., a photodiodes) that receive light photons from ascintillator 521. The scintillator 521 is a conversion layer thatreceives x-rays and generates visible light that strikes photodetectorlayer 526. Photodetector layer 526 captures the visible light producedin the scintillator and generates an electric current (I) 529. Theelectric current 529 charges capacitor 528 and leaves a charge value oncapacitor 528, where the integrated charge on capacitor 258 isproportional to the integrated light intensity striking photodetectors526 for a given integration time. Capacitor 528 is coupled to switch 532such as a thin-film-transistor (TFT). The operation of switch 532 may bediscussed herein in relation to a TFT for ease of discussion purposesonly. Other types of switch devices, for example, switching diodes mayalso be used.

At an appropriate time, the control input 530 (e.g., gate of a TFT)activates switch 532 and reads out the charge on capacitor 528 at node534. The charge at node 534 is further amplified and processed for acorresponding pixel of flat panel detector 276, as discussed below inrelation to FIG. 7.

In an alternative embodiment, flat panel detector 276 may have otherconfigurations. For example, flat panel detector 276 may utilize asemiconductor material as a direct conversion layer to convert x-rays toelectric charges directly, without an intermediate step of convertingx-rays to visible light. FIG. 5B illustrates one embodiment of flatpanel detector 276 having a direct conversion layer 535. The flat paneldetector 276 has conversion layer 535 composed of a semiconductormaterial disposed between a top electrode layer 531 andcharge-collection electrode layer 533. A bias voltage 536 is appliedacross semiconductor layer 535 incident to the top electrode 531. Asx-rays 524 propagate through the semiconductor layer 535 through the topelectrode 531, it creates electric charges within the semiconductorlayer 535 that are drawn to the charge-collection layer 533. The chargeis collected, amplified and processed for a corresponding pixel of flatpanel detector 276.

A significant increase in detector sensitivity can be gained byutilizing a flat panel detector 276 coated with a wide bandgap (e.g., inthe approximate range of 0.5 to 3 eV) semiconductor as a conversionlayer 535. Semiconductors act as direct conversion materials. Thepassage of x-ray photons generates electrons and holes that are sweptout of the photoconducting conversion layer 535 by an applied biasvoltage and collected on a switch (e.g., TFT) array. In one embodiment,a polycrystalline mercury-iodide (HgI₂) may be deposited on TFT panelsto form direct detection arrays with very high sensitivity, approachingthe theoretical maximum. This sensitivity may be more than five timesbetter than that of flat panel detectors with scintillator layers thatemploy indirect conversion.

It should be noted that alternative configurations and components knownin the art may be used with flat panel detector 276. For example, theflat panel detector 276 may be integrated with CCD-based or CMOS-basedphotodetectors. Flat panel detectors are available from manufacturerssuch as Varian Medical Systems, Inc. of California.

FIG. 6 shows the x-ray sensitivity of an exemplary polycrystalline HgI₂detector layer operating at room temperature with 80 KV(p) photons. Thematerial has sensitivity in the range of 15 μCoulombs/R/cm² that isapproximately five times higher than some of the better performing CsIscintillator materials. The curves of sensitivity versus bias voltageshow saturation at a bias field below 1volt/micron that is important toavoid voltage dependent gain variations during operation at high signallevels.

Although detector 276 may be operated at room temperature, detector 276may also be cooled below room temperature (e.g., down to approximatelyminus 100 degrees C.) in order to reduce dark current contributions tothe collected charge on the capacitors 528 of the detector 276. Coolingof a semiconductor conversion layer detector results in lower noise andpermits a higher bias voltage. The latter improves the rate at whichcharge carriers are swept out of the semiconductor, which increases themaximum attainable count rate for photons and improves the energyresolution. Wide band-gap semiconductors have relatively low darkcurrents even at room temperature and the dark current has a steepdependence upon temperature. Although operation at liquid nitrogentemperature is not required, cooling semiconductors such as HgI₂ totemperatures of the order of minus 30° C. is beneficial, with a somewhatlower optimum operating temperature for CZT. These temperatures can bereached, for examples, with a solid state Peltier cooler (down toapproximately minus 70° C.). Peltier coolers, also known asthermoelectric coolers, are solid state heat pumps that take advantageof the Peltier Effect. The Peltier effect takes place when an electriccurrent is sent through two dissimilar materials that have beenconnected to one another at two junctions. One junction between the twomaterials is made to become warm while the other becomes cool, in whatamounts to an electrically driven transfer of heat from one side of thedevice to the other. Peltier coolers are available from differentmanufacturers such as Swiftech of California, USA. In alternativeembodiments, other temperatures and other types of cooling systems maybe used, for example, a closed circuit cascade cooling system (e.g.,available from IGC Polycold Systems of California, USA) that can cool aslow as approximately minus 100° C.

FIG. 7 illustrates one embodiment of, in particular, electroniccomponents of the scanning system 200. Scanning system 200 includes acomputing device 704 coupled to a flat panel detector 276. As previouslydiscussed in relation to FIGS. 5A and 5B, flat panel detector 276operates by accumulating charge on capacitors (e.g., capacitor 528)generated by pixels (e.g., pixel 279 of FIG. 2C) of photodetectors witha scintillator layer 521 or by pixels of a direct conversion layer 535.Typically, many pixels are arranged over a surface of flat paneldetector 276 where, for example, TFTs (or e.g., single and/or doublediodes) at each pixel connect a charged capacitor 528 to chargesensitive amplifier 719 at the appropriate time. Charge sensitiveamplifier 719 drives analog to digital (A/D) converter 717 that, inturn, converts the analog signals received from amplifier 719 intodigital signals for processing by computer device 704. A/D converter 717may be coupled to computing device 704 using, for example, I/O device710 or interconnect 714. A/D converter 717 and charge sensitiveamplifiers 719 may reside within computing device 704 or flat paneldetector 276 or external to either device. Amplifiers 719 count thephotons received by flat panel detector 276 and provide a pulseproportional to the received energy. Amplifiers 719 transmit the pulseto A/D converter 717. A/D converter 717 converts the pulse heights to adigital value that is provided to computing device 704.

The methods, steps, instructions, etc. that are performed by computerdevice 704, as discussed below, may be performed by hardware componentsor may be embodied in machine-executable instructions (or a combinationthereof), which may be used to cause a general-purpose orspecial-purpose processor programmed with the instructions to performthe steps. Machine-executable instructions may be contained in machinereadable medium that includes any mechanism for storing or transmittinginformation in a form (e.g., software, processing application) readableby a machine (e.g., a computer). The machine-readable medium mayincludes, but is not limited to, magnetic storage medium (e.g., floppydiskette); optical storage medium (e.g., CD-ROM); magneto-opticalstorage medium; read only memory (ROM); random access memory (RAM);erasable programmable memory (e.g., EPROM and EEPROM); flash memory;electrical, optical, acoustical or other form of propagated signal(e.g., carrier waves, infrared signals, digital signals, etc.); or othertype of medium suitable for storing electronic instructions. Particularreference to hardware or software herein is made only for ease ofdiscussion.

Computing device 704 is coupled to conveyor 250 to control the positionof container 240 through, for example, position control circuitry 721.Computing device 704 is coupled to projection image acquisitioncircuitry to 722 to receive signals indicative of the undiffracted x-raybeam from linear detector 290 and provide a projection line scan imageof container 240. Computing device 704 implements the methods forprocessing of the digital signals provided by A/D converter 717 toprovide an output for identification of the substance being scanned asis known in the art. In one embodiment, computing device 704 includes aprocessor 706, storage device 708, input/output (IO) device(s) 710, andmemory 712 that are all coupled together with interconnect 714, such asa bus or other data path.

Processor 706 represents a central processing unit of any type ofarchitecture (e.g., Intel architecture or Sun Microsystemsarchitecture), or hybrid architecture. In addition, processor 706 couldbe implemented in one or more semiconductor chips. Storage device 708represents one or more mechanisms for storing data and/or instructionssuch as the method steps of the invention. Storage device 708 representsread-only memory (ROM), random access memory (RAM), magnetic diskstorage media, optical storage media, flash memory devices, and/or othermachine-readable media. Interconnect 714 represents one or more buses(e.g., accelerated graphics port bus, peripheral component interconnectbus, industry standard architecture bus, X-Bus, video electronicsstandards association related buses, etc.) and bridges (also termed buscontrollers). I/O device(s) 710 represents any of a set of conventionalcomputer input and/or output devices including, for example, a keyboard,mouse, trackball or other pointing device, serial or parallel inputdevice, display monitor, plasma screen, or similar conventional computerI/O devices. Memory 712 represents a memory device for retaining dataand processor instructions for processor 6 according to the method stepsof the invention. Memory 712 can be implemented using any of the memorydevices described above for storage device 8. In addition, memory 712can be used as a data cache for processor 706. It should be noted thatthe architecture illustrated in FIG. 7 is only exemplary. In alternativeembodiments, other architectures may be used for computing device 704.For examples, computing device 704 may utilize memory controller(s)and/or I/O controller(s) that are dedicated or integrated into one ormore components. For other examples, while computing device 704 isdescribed in relation to a single processor computing system, amulti-processor computing device may be used and/or a distributedcomputing environment may be used where the machine readable medium isstored on and/or executed by more than one computing devices.

Referring again to FIGS. 2A and 2B, an alternative method of obtainingdiffraction data from the contents of the container is to position thecollimator and detector assembly at a fixed angle to the incident beam.If the acceptance angle θ for photons is fixed then, from the Braggequation, specific x-ray photon wavelengths will be diffracted from thevarious crystal lattice d-spacings at a given diffraction angle. Thephoton wavelengths, and hence energies, are defined by the latticespacings and the selected photon acceptance angle. Energy dispersivediffraction scanning may be capable of much more efficient use of thex-rays from the line-source x-ray tube, coupled with the ability to scanthrough the entire diffraction spectrum in parallel rather thanserially.

For energy dispersive diffraction the x-ray sheet beam does not need tobe monochromatic but may be merely collimated directionally bytechniques known in the art. As such, much greater total power in thecontinuum output of source can be used. With energy dispersivediffraction scanning, the incident x-ray sheet beam 220 contains a broadrange of photon energies. Each wavelength has an associated photonenergy. The smaller the wavelength, the higher the photon energy. Theunfiltered bremsstrahlung radiation from, for example, a tungsten (W)target contains a suitable spread of photon energies. Alternatively,other materials for target 211 may be used. The incident electron beamenergy is chosen to furnish a sufficiently high cut-off in the x-rayphoton energy.

The appropriate photon takeoff angle may be derived by simulation orempirical data. For example, FIG. 3 that shows the diffraction lines ofTNT. As the diffraction angle θ is increased, the diffracted photonenergies shift downwards. Lower photon energies will be preferentiallyabsorbed during passage through the container. A photon takeoff angle of2–2.5° results in an appropriate range of photon energies for detectionof TNT.

The flat panel detector 276 is provided with a photoconductor layer 535capable of providing a pulse height output that is proportional to theenergy of the photons incident on the detector. Photoconductors that maybe used for conversion layer 535 include, for examples, CZT, HgI₂, PbI₂,Se or other wide bandgap semiconductor materials. The acceptance angleof the panel for incident photons may be defined by the collimator(s) ina similar manner to the wavelength dispersive arrangement. However, theacceptance angle may be held constant (e.g., typically 2–3 degrees awayfrom the sheet beam axis). In this case, specific x-ray photon energiesare diffracted by the d-spacings of the material at this chosen angle.Only photons with these specific energies can pass through thecollimator 274 at the selected angle. The flat panel detector 276measures the energy of the diffracted photons, thus characterizing thematerial. This method has the advantage that the energy data can bemeasured in parallel, hence greatly increasing the scan speed.Additionally, a mono-energetic primary x-ray sheet beam 220 is notrequired and the entire continuum output of the x-ray generator 210 canbe used that increases the efficiency of x-ray generation andutilization in the incident x-ray sheet beam 220.

In an alternative embodiment, the electronic components of flat paneldetector 276 and scanning system 200 may be modified from that shown inFIGS. 5A, 5B, and 7 for use with the energy dispersive mode. FIG. 9illustrates an alternative embodiment of a flat panel detector that maybe used with an energy dispersive mode of scan operation. In thisembodiment, with reference to FIGS. 5B, 7 and 9, flat panel detector 276includes an array of pixels having two sets of parallel conductor lineson the top and bottom of a semiconductor conversion layer (e.g.,conversion layer 535 of FIG. 5B). A set of conducting read-out lines (X₁to X_(N)) 971 runs in the x-direction on the top face and a set ofconductors (Y₁ to Y_(N)) 972 runs in the y-direction on the bottom faceof the semiconductor layer 535. A bias voltage 536 is applied throughthe thickness of the semiconductor layer 535 between the set of x lines971 and the set of y lines 972. Pulse measurement circuits may bedisposed around the periphery of the detector array 276 to measurepulses, as the pulses appear on the x and y lines 971 and 972,respectively.

The pulse measurement circuits may include pulse amplifiers (PA) 910 and915, timing correlator 920, pulse shaping amplifier 925, and peakdetector 930. The output of amplifiers 910 and 915 may be coupled totiming correlator 920. Timing correlator 920 uses coincidence timing toassign an x-y line pair to a particular pulse event, thereby localizingthe position (pixel) at which the charge originated in the semiconductorlayer 535. The pulses of charge are passed though a pulse shapingamplifier 925. In one embodiment, for example, the pulse shapingamplifier 925 may have a time resolution of the order of 2–20microseconds that gives an output pulse proportional to the chargedelivered in the initial pulse. The output pulse is fed to a peakdetector 930 and an A/D converter 917 where the pulse amplitudes areconverted to a digital value. The resulting A/D output is used as theaddress of a memory location in an array (e.g., array 941) of a digitalmemory 712. In effect, the memory arrays act as a series of individualcounters each covering a narrow range in energy. Counts are accumulatedin these “bins” or “channels” building up a digital representation ofthe energy distribution of the diffracted photons, which is thediffraction spectrum in the energy domain. Each pixel in the detectorarray 976 has an associated array of digital memory addresses and aspectrum in the energy domain energy is accumulated for each 2-D pixelposition in the detector. The pixels map back to the equivalentpositions in the plane of the x-ray sheet beam 220 as it passestransversely through container 240.

Various alternatives may also be used. It is desirable to keep the pulseof charge from each incident photon separate from the pulse fromsubsequent photons. At high count rates, a second pulse may reach theamplifier before the pulse from the first photon is fully processed.This results in a phenomenon known as pulse pile-up of a total pulsethat is a combination of two pulses. In one embodiment, pulse pile-uprejection circuits may be incorporated into the electronics.

Considerable improvement in signal-to-noise can be achieved by locatinga front-end amplifier at each pixel rather than having simple x-yread-out lines and peripheral read-out pulse measurement circuits. Inone embodiment, for example, the front-end amplifier may be implementedas a layer 538 between the substrate 527 and the conversion layer 535 asillustrated in FIG. 5C.

In yet another embodiment, the x and y read-out lines 971 and 972 mayalso be incorporated into substrate 527. The top surface ofsemiconductor conversion layer 535 has a top electrode 531 in the formof a continuous conducting layer to which the bias voltage 536 isapplied. Such a configuration may simplify fabrication of the flat paneldetector 276 when using certain semiconductor materials for conversionlayer 535 such as HgI₂ that are difficult to lay down contacts upon. Acontinuous contact sheet of, for example, evaporated palladium, may beeasier to arrange than many narrow contact lines. Alternatively, othermetal and metal alloys may be used for the contact layer 531. The x andy read-out lines 971 and 972 may be fabricated into substrate 527 at thesame time as the pixel amplifier layer 538 before deposition ofconversion layer 538. Each pixel would have a contact pad (defining thearea of the pixel) above the amplifier in layer 533. The contact padscollect the pulse of the charge from semiconductor conversion layer 535,feed the pulse to the amplifier 538 that amplifies the pulse andprovides it into the x-y lines in substrate 527.

In an embodiment where CZT is used as the conversion layer 535, theconversion layer 535 may have the form of a mosaic of tiles or strips ofCZT supported upon a substrate. High performance CZT is not apolycrystalline material that can be deposited by physical vapordeposition (PVD) but is composed of monolithic single crystal piecessliced from boules grown by high pressure Bridgeman crystallization. Thesame x-y read-out line scheme may be used and if individual pixelamplifiers are used they can be implemented, for example, as anamplifier layer 538 above the substrate 527 as illustrated in FIG. 5C.The amplifier layer 538 may be coupled to the CZT conversion layer 535,for example, by bump-bonding amplifier layer 538 to the underside of theCZT layer. Alternatively, other coupling methods may be used.

In one embodiment, the use of very large pixels (by display standards)in the diffraction detector makes it possible to subdivide each pixelinto subpixels to reduce the performance requirement of the front endamplifier and read-out electronics. Each sub-pixel receives only afraction of the photon flux incident on the pixel that reduces pulsepile-up and increases the maximum photon count rate under large signalconditions.

As previously discussed, a scintillator based detector may be used inpulse counting mode but is not commonly employed because of its lowx-ray conversion efficiency compared to semiconductor direct conversiondetectors. For the same x-ray photon energy deposited in the detector afactor of five or more electrons are obtained from a semiconductordetector as compared to a scintillator detector. This means thatscintillator detectors have a lower signal to noise ratio and the lowerabsolute signal means less precision of energy measurement.

The 2D area flat panel detector discussed herein permits the spatiallocation of the of diffracted x-rays within container 240 where thesearched-for substance is concealed. The cross section of the container240 defined by the x-ray sheet beam 220 is mapped onto the flat paneldetector 276 array surface with compression of the vertical direction241. The use of a low cost, large-area, wide bandgap semiconductordetectors capable of single photon counting with adequate energyresolution would eliminate the constraints of existing scanning systemsand permit single pass diffraction scanning at much higher speed. Itshould be noted again that the diffraction-based detection systemdiscussed herein can detect almost any crystalline and, in particular,microcrystalline substance, including many illegal drugs and othercontraband materials in addition to explosive materials.

In the foregoing specification, the invention has been described withreference to specific exemplary embodiments thereof. It will, however,be evident that various modifications and changes may be made theretowithout departing from the broader spirit and scope of the invention asset forth in the appended claims. The specification and drawings are,accordingly, to be regarded in an illustrative sense rather than arestrictive sense

1. An x-ray scanning system, comprising: a conveyor; an x-ray sourceconfigured to generate x-rays toward the conveyor; and a flat paneldetector to receive diffracted x-rays from a container moving on theconveyor through the x-rays; a first collimator coupled to the flatpanel detector; and a second collimator disposed between the conveyorand the first collimator, wherein the first and second collimators havecollimation planes orthogonal to each other.
 2. The x-ray scanningsystem of claim 1, wherein the first collimator has collimation planesto divide the diffracted x-rays into individual vertical segments. 3.The x-ray scanning system of claim 1, wherein the scanning system has adetector assembly comprising the first collimator and the flat paneldetector.
 4. The x-ray scanning system of claim 3, further comprising aplurality of detector assemblies, each of the plurality of detectorassemblies having the first collimator and the flat panel detector. 5.The x-ray scanning system of claim 4, wherein the x-rays generatedtoward the conveyor lay substantially in a plane and wherein at leastone of the plurality of detector assemblies is disposed on an oppositeside of the plane in relation to another of the plurality of detectorassemblies.
 6. The x-ray scanning system of claim 1, wherein the x-rayssource generates an x-ray sheet beam having a width approximately in therange of 2 millimeters to 2 meters.
 7. The x-ray scanning system ofclaim 1, wherein the x-ray source generates a plurality of parallelcollimated beams.
 8. The x-ray scanning system of claim 1, wherein thex-ray source comprises a target that generates radiation in the range of30 to 120 KeV.
 9. The x-ray scanning system of claim 8, wherein thetarget comprises tungsten.
 10. The x-ray scanning system of claim 1,wherein the x-rays source generates an x-ray sheet beam.
 11. The x-rayscanning system of claim 1, wherein the x-ray source generates aplurality of parallel collimated beams.
 12. The x-ray scanning system ofclaim 1, wherein the x-ray source comprises a target that generatesradiation in the range of 30 to 120 KeV.
 13. The x-ray scanning systemof claim 12, wherein the target comprises tungsten.
 14. The x-rayscanning system of claim 1, wherein the flat panel detector comprises aconversion layer, wherein the conversion layer comprises an amorphousmaterial.
 15. The x-ray scanning system of claim 14, wherein theamorphous material is polycrystalline.
 16. The x-ray scanning system ofclaim 14, wherein the conversion layer comprises a depositedsemiconductor material having a bandgap in the approximate range of 0.5to 3 eV.
 17. The x-ray scanning system of claim 16, wherein theconversion layer comprises HgI₂.
 18. The x-ray scanning system of claim16, wherein the conversion layer comprises PbI₂.
 19. The x-ray scanningsystem of claim 18, further comprising a cooling system coupled to theflat panel detector, and wherein the cooling system is operable to coolthe flat panel detector down to approximately minus 30 degrees C. 20.The x-ray scanning system of claim 16, wherein the conversion layer hasa surface area greater than 25 square centimeters.
 21. The x-rayscanning system of claim 16, wherein the conversion layer has a surfacearea in the approximate range of 25 to 2,250 square centimeters.
 22. Thex-ray scanning system of claim 1, wherein the flat panel detector has asurface area greater than 25 square centimeters.
 23. The x-ray scanningsystem of claim 1, wherein the flat panel detector is configured tooperate at room temperature.
 24. The x-ray scanning system of claim 1,wherein the first and second collimators are Soller collimators.
 25. Thex-ray scanning system of claim 24, wherein the first collimator has anacceptance angle of less than approximately 0.2 degrees.
 26. The x-rayscanning system of claim 3, wherein the detector assembly is fixed toselect a particular diffraction angle range.
 27. The x-ray scanningsystem of claim 26, wherein the diffraction angle range is approximately2 to 3 degrees relative to the generated x-ray axis.
 28. The x-rayscanning system of claim 14, wherein the conversion layer comprises CZT.29. The x-ray scanning system of claim 28, further comprising a coolingsystem coupled to the flat panel detector, and wherein the coolingsystem is operable to cool the flat panel detector down to approximatelyminus 70 degrees C.
 30. The x-ray scanning system of claim 1, furthercomprising a cooling system coupled to the flat panel detector, andwherein the cooling system is operable to cool the flat panel detectorto a temperature, the temperature being in the approximate range ofminus 30 degrees C. to minus 100 degrees C.
 31. An x-ray scanningsystem, comprising: a conveyor; an x-ray source configured to generatex-rays toward the conveyor; and a flat panel detector to receivediffracted x-rays from a container moving on the conveyor through thex-rays, wherein the flat panel detector is movable to select aparticular diffraction angle of photons emitted from inside a bag forreceipt by the flat panel detector.
 32. The x-ray scanning system ofclaim 31, wherein the detector assembly further comprises the secondcollimator.
 33. The x-ray scanning system of claim 31, wherein thedetector assembly is movable to select a diffraction angle of up toapproximately 4 degrees.
 34. A method of container screening,comprising: providing a flat panel detector having a photoconductorx-ray conversion layer; and screening for a particular substance in acontainer at a transportation center using the flat panel detector toreceive x-rays diffracted from the substance from an x-ray sheet beamincident upon the substance.
 35. The method of claim 34, wherein theconversion layer comprises a scintillator layer.
 36. The method of claim34, wherein the conversion layer is amorphous.
 37. The method of claim34, wherein screening comprises performing a single pass x-raydiffraction scan of the container.
 38. The method of claim 37, whereinscreening further comprises performing a three-dimensional x-raydiffraction scan of the container in the single pass.
 39. The method ofclaim 36, wherein the conversion layer comprises a polycrystallinematerial.
 40. The method of claim 34, wherein the flat panel detector isoperated at room temperature during the screening.
 41. The method ofclaim 34, wherein screening comprises: generating an x-ray sheet beam;directing the x-ray sheet beam through the container; generatingdiffracted x-rays from the x-ray sheet beam, the diffracted x-rayshaving a plurality of diffraction angles.
 42. The method of claim 41,wherein screening further comprises performing an energy dispersive scanof the container to acquire a diffraction spectrum.
 43. The method ofclaim 42, wherein performing the energy dispersive scan comprisesselecting photons from the diffracted x-rays having a particulardiffraction angle for detection by the flat panel detector.
 44. Themethod of claim 42, wherein performing the energy dispersive scanfurther comprises counting single photons selected from the diffractedx-rays as the photons are intercepted by individual pixels in an arrayof pixels of the flat panel detector.
 45. The method of claim 43,wherein the photons are selected using a collimator having an acceptanceangle of approximately 2 degrees.
 46. The method of claim 41, whereingenerating an x-ray sheet beam further comprises generating tungstenk-alpha radiation.
 47. The method of claim 41, wherein the flat paneldetector comprises a two dimensional array of pixels and whereinscreening comprises spatially locating a source of the diffractedx-rays.
 48. The method of claim 47, wherein spatially locating comprisesmapping a cross-section of the container defined by the x-ray sheet beamonto the array of pixels.
 49. The method of claim 48, wherein thecross-section of the container defined by the x-ray sheet beam in thedirection of the beam is compressed when mapped onto the array ofpixels.
 50. The method of claim 48, wherein spatially locating furthercomprising mapping a plurality of the cross-sections of the container togenerate a three-dimensional x-ray diffraction scan of the container ina single pass.
 51. The method of claim 34, wherein screening comprisesperforming a wavelength dispersive diffraction scan of the container.52. The method of claim 34, wherein the conversion layer is crystalline.53. The method of claim 52, wherein the conversion layer comprises CZT.54. An x-ray scanning system, comprising: a two dimensional amorphousflat panel detector array; means for detecting a particular substance ina container at a transportation center using the two dimensionalamorphous flat panel detector array to receive x-rays diffracted fromthe substance; and means for cooling the flat panel detector down tobetween below room temperature and approximately minus 70 degrees C. 55.The x-ray scanning system of claim 54, wherein the means for detectingcomprises means for generating an x-ray sheet beam.
 56. The x-raysscanning system of claim 55, wherein the means for detecting furthercomprises: means for directing the x-ray sheet beam through thecontainer; means for generating diffracted x-rays from the x-ray sheetbeam, the diffracted x-rays having a plurality of diffraction angles;and means for selecting diffracted x-rays to have a diffraction angle ina particular range.
 57. An x-ray scanning system, comprising: aconveyor; an x-ray source configured to generate x-rays toward theconveyor, wherein the x-ray source generates an x-ray sheet beam; and adetector to receive diffracted x-rays from a container moving on theconveyor through the x-rays.
 58. The x-ray scanning system of claim 57,wherein the x-ray sheet beam comprises a plurality of parallelcollimated beams.
 59. The x-ray scanning system of claim 58, wherein thex-ray source comprises a target that generates radiation in the range of30 to 120 KeV.
 60. The x-ray scanning system of claim 59, wherein thetarget comprises tungsten.
 61. The x-ray scanning system of claim 57,wherein the x-ray sheet beam has a width approximately in the range of 2mm to 2 meters.